René Rongen graduated in Physics at the RWTH Aachen (Germany) in 1992. In 1996 he received his PhD Degree in Physics at the TU Eindhoven (The Netherlands). He joined NXP Semiconductors (previously Philips Semiconductors) in 1997. René has always been active in Reliability Physics and is currently an NXP Fellow for reliability technology and competence development on the corporate engineering team, and works from the Nijmegen lab.

René is also NXP’s lead editor of Reliability Policy and Requirements, owner of all product reliability test specs, and the Reliability Knowledge Framework. He actively represents NXP in several industry standards bodies and forums such as AEC, JEDEC and ZVEI. He contributed to the latest revision of AEC-Q100 and -Q006, JESD47 and ZVEI Handbook for Robustness Validation, and served as the lead for the AEC Q004 Zero Defect Framework.

He is (co)author of many papers on various topics, including Cu-wire reliability, solder joint reliability and reliability of WL CSP devices and contributes to IRPS, ESREF, ECTC and AEC-RW; he is a technical committee member for ECTC, ESREF and ESTC.