Post-fab assembly, test, and advanced packaging functions are critical to the successful production of integrated circuits (ICs). At GLOBALFOUNDRIES, we offer post-fab services that play a key role in keeping costs low while simultaneously driving high production volumes, high quality, and high reliability needed to meet the demands of high growth markets.  Post-fab turnkey is a multi-faceted array of bump, test and module assembly services including RF mmWave test, 2.5/3D packaging interposers and antenna-on-package w/ GF ADK models and embedded inductors. The flexible supply chain model is tailored to clients’ needs with services ranging from wafer bumping and digital probe to a more comprehensive spectrum of services including package design, assembly and mmWave over-the-air test.