ASE is blazing new trails in device miniaturization and integration, as demanded by the ongoing transformation of the electronics industry. And so, alongside a broad portfolio of established technologies, ASE is delivering game-changing advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets, such as automotive, mobile, IoT, AI, and high performance computing. For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, please visit : www.aseglobal.com